Paste Soldering for PCB Surface Module SMT Whole Line Equipment

Basic Info.

Model NO.	MJ-MG5
After-sales Service	After Sales Service
Printing Cycle	<7s
Printing Accuracy	+-0.025mm
Use Air	4.5~6kg/Cm2
PCB Warpage	<1%
Line Change Line	<5min
Printing Deviation	up/Down Vision Accurate Alignmnet System to Ensure
Repetitive Positioning Accuracy	+-0.01mm
Type	Dry/Wet/Vacuum, Programmable Screen Cleaning
Application Industry	SMT PCB Material Solder Paste Printing
Transport Package	Ply Box; Plastic Film
Specification	1220*1355*1500
Trademark	MOJE
Origin	Guangzhou, China
HS Code	8479896200

Product Description

ADVANTAGE DESCRIPTION
•Programmable floating print head to improve printing efficiency and prevent solder paste leakage
•Up/down vision accurate alignment system to ensure printing deviation
•Dry/wet/vacuum,programmable screen cleaning system, suitable for different sizes of steel mesh
•The PCB clamping device system isconfigured with a magnetic needle and a vacuum suction cup to
ensure the flexible clamping device on the side of the PCB, so as to ensure that no bending
deformationoccurs when the PCB is clamped
•Manual height adjustment platform for PCBs of different thicknesses - ensure good contact between
PCB and steel mesh
APPLICATION INDUSTRY
•SMT PCB material solder paste printing
SPECIFICATION
Repetitive positioning accuracy:±0.01mm
Printing accuracy: ±0.025mm
Printing cycle: <7s
Line change time <5 Min
Use air: 4.5-6Kg/cm2
PCB size: Minimum (length*width): 50mm*50mm
Maximum(length*width):400mm*340mm
PCB thickness:0.4-6mm
PCB warp age: <1%
Transfer height: 900±40mm
Power Supply : AC:220±10%, 50/60HZ 1@ 3kw
Overall dimensions:1220(L)X1355(W)X1500(H)mm
Machine weight: Approx: 1000 Kg